Perkin Elmer Sputtering Systems 4450 4400 4410 2410

Posted on 1/23/2013
7685 days to go

by Peter Chen ( in CA,United States 

We are able to provide the following Perkin Elmer used sputtering equipment and perform full service for earlier and later models including Refurbishment, upgrade,Repair, and/or Preventive Maintenance.

The 4450 Series system for sputtering and etching reflects an advanced design concept based on a high capacity Load Lock that permits wafer loading without breaking vacuum in the process chamber.

Created specifically for the production environment, the 4450 system provides significant advantages to combine high yield and high throughput resulting in product excllence. The means to handle various thin film coating or etching requirement is accomplished by a broad range of operating modes including: DC Magnetron, RF Magnetron, RF Diode, Bias Sputter, Reactive Sputter, and Sputter Etch.

High Throughput

Quick production cycles are achieved by a fast cycle Load Lock and an efficiently high vacuum pumped Process Chamber. Aluminum alloy deposition rates as high as 200 Ĺ per kW per minute are possible with the Delta™ target system, resulting in production rates exceeding 150 three inch wafers per hour.

High Yield

A rotating substrate table for multi-pass deposition ensures high-uniformity films and run-to-run repeatability, allowing the total control of critical film characteristics. The mechanical design specifically minimizes generation of particles that could cause pinhole defects. Wafer breakage is reduced by easy loading pallet design. Reproducible high quality films are guaranteed through the routine achievement of clean vacuum conditions.
The 4450 Series systems enables the deposition of excellent films with aluminum, aluminum alloys, platinum silicide, titanium-tungsten, nichrome-gold, silicon nitride, silicon dioxide, chrome disilicide, and permalloy.

Step coverage: Vertical to horizontal can approach 70% and is typically better than 50% even with high or undercut steps.

Specularity: Reflectivity as a measure of specularity is at least 60% and can be as good as 80%.
Resistivity: Bulk resistivity is essentially achievable for AI and Al-alloy films with typical values ranging from 2.8 to 2.9 µΩ/cm.

System Capabilities

A considerable choice of target materials, machine operating modes, pressure and gas controls, cathode configurations and power levels are available in the 4450 Series. This versatility provides an unprecedented capacity to perform a wide variety of thin film tasks.

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