Gasonics Aura 1000 Aura 3010 Aura 3000 AE 2001 Aura 2000LL

Posted on 1/23/2013
7963 days to go

by Peter Chen (peterchen@allwin21.com) in CA,United States 


sales@allwin21.com

http://www.allwin21.com/gasonics-plasma-asher-descum-etcher-systems.asp



Gasonics Plasma Asher/Stripper/Echer Systems (Trademark)






Allwin21 Corp. focuses on and professionally provides the following fully refurbished and customized Gasonics Plasma Asher/Stripper/Etcherequipment with high Quality,rightCost,quick Delivery and excelentService for Semiconductor industry,MEMS, Biomedical, Nanotechnology,Solar,LEDs etc.

Gasonics L3510 | Gasonics Aura 1000 | Gasonics Aura 3010 | Gasonics Aura 2000LL| | Gasonics AE 2001

In semiconductor manufacturing plasma ashing is the process of removing the photoresist from an etched wafer. Using a plasma source, a monatomic reactive species is generated. Oxygen or fluorine are the most common reactive species. The reactive species combines with the photoresist to form ash which is removed with a vacuum pump.

Typically, monatomic (single atom) oxygen plasma is created by exposing oxygen gas at a low pressure (O2) to high power radio waves, which ionise it. This process is done under vacuum in order to create a plasma. As the plasma is formed, many free radicals are created which could damage the wafer. Newer, smaller circuitry is increasingly susceptible to these particles. Originally, plasma was generated in the process chamber, but as the need to get rid of free radicals has increased, many machines now use a downstream plasma configuration, where plasma is formed remotely and the desired particles are channeled to the wafer. This allows electrically charged particles time to recombine before they reach the wafer surface, and prevents damage to the wafer surface.

Two forms of plasma ashing are typically performed on wafers. High temp ashing, or stripping, is performed to remove as much photo resist as possible, while the "descum" process is used to remove residual photo resist in trenches. The main difference between the two processes is the temperature the wafer is exposed to while in an ashing chamber.

Monatomic oxygen is electrically neutral and although it does recombine during the channeling, it does so at a slower rate than the positively or negatively charged free radicals, which attract one another. Effectively, this means that when all of the free radicals have recombined, there is still a portion of the active species available for process. Because a large portion of the active species is lost to recombination, process times may take longer. To some extent, these longer process times can be mitigated by increasing the temperature of the reaction area.

Allwin21 Corp. professionally provides the following plasma Ashing/Stripping/Descum semionductor equipment with high Quality,right Cost,quick Delivery and excelent Service.


Matrix 105R | Matrix 105/205/106 | Branson IPC L3200 |Branson IPC 2000/3000/4000 | Gasonics L3510 | Gasonics Aura 1000 | Gasonics Aura 3010 | Gasonics Aura 2000LL